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OWEGO, NY – More than 75 attendees from 29 member companies descended upon Universal Instruments’ Advanced Process Lab last week for its annual Advanced Research in Electronics Assembly consortium.
Topics during the Oct. 28-29 event ranged from Pb-free solder microstructure and reliability to environmental stress screening procedures.
The opening session reviewed systematic results of thermal cycling of Pb-free soldered assemblies and discussed network analysis of this and previous thermal cycling data. Other topics included pad cratering research and new thermal interface materials, reliability testing of various TIMs, as well as a discussion on insights into Pb-free metallurgy. Also examined was the evolution of Pb-free solder microstructure.
The event included updates on edge and corner bonding and efforts to define a practical, safe screening test for the identification of inferior electrolytic nickel; i.e., NiAu coatings that may give “missing balls” or brittle failure of the intermetallic bond subsequent to reflow.
Other topics included flux dipping of flip chips, reballing, ENEPIG coatings, and an overview of all past consortium reports and how to effectively use them for reference.
SEATTLE – DfR Solutions has established a office here to provide interaction with local consumer electronics OEMs, aerospace manufacturers, and system integrators.
Dr. Randy Kong will head the office. Kong has more than 18 years of experience in reliability risk analysis of product and technology development.
DfR Solutions provides quality, reliability, and durability solutions.
EL SEGUNDO, CA -- China’s gray-market cellphone shipments this year are set to grow to 145 million units, or nearly 13% of the size of the legitimate global cellphone business.
SAN JOSE -- SEMI has published three new standards aimed at facilitating identification of counterfeit IC chips.
LONDON -- September sales of semiconductors rose 20% worldwide sequentially to $24 billion in the third quarter.
TORRANCE, CA — Seika Machinery has developed an application for the recovery of data and removal of moisture from cellphones submerged in water.
WASHINGTON -- New orders for manufactured goods rose in September for the fifth time in six months, increasing 0.9%
to $356.1 billion, the US Census Bureau reported today. Durables orders were up 1.4% sequentially.
WASHINGTON – The US International Trade Commission said it would review a judge’s final initial determination issued Aug. 28, in which no violations of certain Tessera patents were found.
The complaint, which Tessera initially filed in January 2008, alleges violations against its patents involving importation of certain semiconductors of minimal package size.
The complaint originally named 18 respondents. The following remain in the investigation: Acer and Acer America; Centon Electronics; Elpida Memory and Elpida Memory (USA); Kingston Technology; Nanya Technology and Nanya Technology Corp. USA; Powerchip Semiconductor; ProMOS Technologies; Ramaxel Technology; Smart Modular Technologies.
The parties are requested to brief their positions on the issues under review; the commission is interested in receiving written submissions that address the form of remedy, if any, that should be ordered.
Written submissions and proposed remedial orders are requested by Nov. 13.
SAN JOSE – Third-quarter worldwide semiconductor sales were $61.9 billion, up 19.7% sequentially, the Semiconductor Industry Association reported today. Sales were down 10.1% year-over-year.
September sales were $20.1 billion, up 8.2% from August.
“Global semiconductor sales in the third quarter were above expectations,” said SIA President George Scalise. “September sales were in line with historical patterns, reflecting increased demand from end-users as they began the build for the holiday season. Unit sales of personal computers and cell phones – the two largest demand drivers for semiconductors – continue to run ahead of earlier forecasts. Meanwhile, demand for semiconductors for industrial applications – a sector that had declined sharply – showed initial signs of recovery. Sales increased in all geographic regions.
“Amid signs that we are in the early stages of recovery in the global economy, semiconductor sales continue to reflect normal seasonal patterns. Sales are running well ahead of the worst-case scenarios projected early in the year, and we are optimistic that total sales for 2009 will be better than our mid-year forecast,” Scalise concluded.
SHENZHEN -- Nam Tai Electronics reported third-quarter sales fell 31.2% to $110.4 million on slower demand for consumer electronics and telecom equipment.
BANNOCKBURN, IL – North American PWB shipments in September were up 21.8% sequentially, while orders increased 31%.
PWB shipments decreased 14.3% year-over-year, while orders dropped 6.4%.
Year to date through September, shipments were down 25.5%, and orders fell 23.4%.
The book-to-bill ratio reached 1.08, up 1 basis point from August. It was the fifth straight month the ratio topped 1.0, the benchmark for a market on the rise.
For the month, rigid PWB shipments declined 15.9% and orders fell 7.8% year-over-year. Year to date, rigid shipments were down 27.3%, while orders dropped 24.7%. Sequentially, rigid shipments grew 21.7%, and orders increased 29.7%. The rigid book-to-bill ratio was flat at 1.09.
Flex shipments in September rose 7.9%, while orders increased 12.1% compared to September 2008. Year to date, flex shipments were down 1.5%, and orders were down 4.9%. Sequentially, flex shipments went up 22%, and orders increased 48.1%. The flex book-to-bill climbed three basis points to 0.95.
A ratio of more than 1.0 suggests current demand is ahead of supply, which is a positive indicator for sales growth over the next two to six months. A ratio of 1.08 means that for every $100 worth of boards shipped, $108 worth of orders were placed.
In September, 84% of total shipments reported were domestically produced. The remainder were likely built offshore and resold by domestic fabricators.
