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CLINTON, NY – Indium Corp. has acquired the processes, equipment, and know-how of Reactive NanoTechnologies Inc., developer and manufacturer of NanoFoil.

Indium will move the RNT process and equipment, and a core staff, to its Utica, NY facility.

Customers will now place orders and inquiries directly through Indium. The core RNT team and Indium personnel will support NanoFoil and NanoBond businesses.

No financial terms of the agreement were disclosed.

ATLANTA – Siemens Electronics Assembly Systems has moved to an expanded complex north of Atlanta. The move was finalized in July.

The facility, located in Suwanee, GA, is now fully operational.

ERLANGER, KY – SEHO North America Inc. has relocated here, near Cincinnati.

EL SEGUNDO, CA – Shipments of large-sized TFT-LCD panels reached 47.1 million units in June, up 26.2% year-over-year and 9% sequentially, says iSuppli Corp.

BROMMA, SWEDEN – Alpha and AIM have released solder pastes designed and qualified for the Mydata MY500 Jet Printer.

SINGAPORE – Flextronics International Ltd. has sold its remaining stake in its former software development business to private equity firm Kohlberg Kravis Roberts & Co. and Canada's CPP Investment Board for $255 million.

The firm said it is selling the stake to raise cash and improve financial flexibility.

Flextronics sold most of its stake in the business to KKR in 2006. The New York-based firm paid roughly $900 million for the unit, now a privately held company called Aricent, and Flextronics kept a 15% stake.

KKR says its total stake in the company is now 79%.

SCOTTSDALE, AZ – In a remarkable turnaround, July IC sales and unit volume numbers indicate the IC industry is in the midst of a solid rebound, says IC Insights.

Data show the upturn is being experienced across many product lines, including DRAM, NAND flash memory, analog and microprocessors, as well as the overall IC industry.

Growth has been explosive in the seven-month period from January to July; this is true for both dollar and unit volume. Granted, in January, the semiconductor market was at (or nearly at) its lowest point of the current downturn, but there is no doubt from examining July data that markets have rebounded – in several cases, surpassing levels from the same time last year, according to the firm.

IC Insights believes the market for ICs is set up for strong growth continuing into 2010 and 2011. Several global and US companies have hinted about stronger bookings and/or production ramps through the balance of this year and 2010.

GDP outlooks have moved well into positive territory and, in the US, about 60% of the $750 billion economic stimulus package is expected to be spent in 2010 and 20% in 2011.

What has captured IC Insights' attention above all else is that many wafer fabs and production lines have closed since the fourth quarter of 2008, resulting in reduced industry-wide capacity as the market returns to health. Recently, IC Insights showed IC industry capacity utilization jumped to 78% in the second quarter from 57% in the first, and forecasts an increase to around 90% by the end of the year.

With significant IC unit demand on the horizon and little capital spending being allocated for new and upgraded facilities, industry-wide capacity utilization stands a good chance of being maxed out in the coming months, resulting in longer lead times, spot shortages, and escalating average selling prices throughout the industry, concludes IC Insights.

BANNOCKBURN, IL – An IPC survey due today on IPC-J-STD-709 revolves around the debate over whether the proposed standard's requirements will be based on a verifiable series of tests.

SAN JOSE – North America-based manufacturers of semiconductor equipment posted $599 million in orders in August and the book-to-bill remained above the key 1.0 level indicating future growth.

HERNDON, VA – The International Electronics Manufacturing Initiative is planning a two-day workshop to identify gaps and challenges related to organic substrate technology. The event will take place Nov. 17 and 18 in Nagoya, Japan.

The meeting will bring together OEMs, packaging firms and substrate providers to discuss technology requirements that must be addressed to facilitate continued miniaturization of electronics packaging.

The goal is to prevent organic substrate technology from becoming a limiting factor in the continued growth of electronics, iNEMI says.

Speakers will discuss packaging-related topics, such as next-generation product sector needs, assembly challenges, and emerging packaging formats. Working teams then will address key topics identified, and formulate potential industry action plans.

The agenda includes confirmed speakers from Amkor, ASE, Cisco, EIT, Ibiden, iNEMI, Intel, Kyocera, Nan Ya, Qualcomm, STATS ChipPAC, Texas Instruments and UMTC.

For more information, visit http://www.inemi.org/cms/calendar/Packaging_Substrates_Nov09.html.