BANNOCKBURN, IL – A new report on silicon-on-chip and system-in-package integration identifies embedded components as a key emerging technology in component and product miniaturization. The research, by Prismark Partners, looks at the impact of miniaturization on the supply chain and how it drives certain technology and business shifts.  It also forecasts technology needs and market opportunities for all electronic interconnects segments.

The report focuses on three major end-product industries – PCs, handheld electronics, and datacom/telecom infrastructure equipment. It also addresses leading OEMs’ technology roadmap requirements, according to IPC, which commissioned the report.

The report, “Microelectronics: The Future of Miniaturization and its Impact on Electronics Manufacturing,” is available from IPC.

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