ENDICOTT, NY – Endicott Interconnect Technologies, in concert with Binghamton University and Cornell, has launched the Center for Advanced Microelectronics Manufacturing. The joint project intends to pioneer microelectronics manufacturing research and development in a roll-to-roll format.
 
These efforts are expected to result in flexible, rugged, lightweight electronic components and innovative products critical in areas such as military and homeland security, lighting, energy and power generation, displays, and product identification and tracking.
 
“R&D is our engine for the creation of new products and intellectual property, as well as an important tool for solving today’s manufacturing issues,” said James McNamara, president and CEO of EI. “This collaboration between industry and academia has resulted in a truly impressive CAMM facility that will be the backbone of tomorrow’s electronics and helps to support our long-range technology efforts.”
 

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