KUALA LUMPUR – Unisem and its subsidiary Unisem-Advanpack Technologies have entered into an agreement with FlipChip International to license FCI’s wafer bumping and wafer level packaging technologies.
 
UAT will license FCI’s core technologies, including Spheron, and FCI will become a shareholder of UAT.
 
“This new partnership with FCI will enable Unisem to offer additional cutting-edge wafer bumping and wafer level packaging alternatives to our customers,” said S.C. Lau, general manager of UAT. “FCI is providing all necessary documentation, training and engineering support for a fast ramp of its wafer bumping and wafer-level packaging technologies, which will be quickly integrated into our existing full production environment.”
 

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