SHENZHEN – The SMTA China Chapter, in conjunction with the Nepcon South China trade show producers, will sponsor the conference program Aug. 24 – 30, in Shenzhen. 
 
The event will address electronics manufacturing, advanced packaging and Pb-free reliability. Topics will range from 01005 assembly and state-of-the-art inspection and failure analysis to market trends and cost reduction initiatives.
 
The premiere Nepcon Best Engineer award also will be announced during the event. Engineers can nominate themselves, or companies can recommend candidates through Reed Exhibitions China.
 
For more information about the SMTA conference and Best Engineer award, visit www.nepconchina.com.
 

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