BANNOCKBURN, IL – A new standard for testing and identifying the worst-case thermal process limitations for all electronic components that may be processed as part of a assembly was released today.
 
J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes, covers passives, connectors, switches and other devices. The standard was developed jointly by IPC, JEDEC and ECA (Electronic Components Association). 
 
J-STD-075 provides classifications to cover higher preheat, reflow and wave soldering common in lead-free processing. The higher temperatures can cause components to melt, warp, crack, delaminate or popcorn. 
 
The standard is a companion to J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices, which covers nonhermetic ICs. It should serve to clear up misconceptions among users who have been using J-STD-020 for non ICs.
 
"Users have been taking profile for J-STD-020 and using the same profile whether IC or non IC, and using the same moisture sensitivity levels. What J-STD-75 uses is PSL – process sensitivity level," Steve Martell, who chairs the task group, told Circuits Assembly. 
 
Paul Krystek of IBM, who submitted an internal document that later was molded into J-STD-075, said, "There was no consistency among suppliers of LEDs to even say which peak temperature could be common. Same with relays. And virtually every connector is unique in terms of size and where it goes on the card. They don’t have the families of components" typical of ICs.
 
The new spec also includes classification categories to identify cleaning process sensitivity. There is also a wild-card option that component manufacturers can use to identify process issues not covered by this standard. J-STD-075 references the packaging and labeling requirements of J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices. J-STD-075 supersedes IPC-9503.

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