SOUTH PLAINFIELD, NJ – Cookson Electronics’ Assembly Materials Group has promoted Rick Ertmann to president, responsible for its Alpha and Semiconductor Packaging units.

Ertmann has been with Cookson's AMG unit since 1987, and has run its Americas, European and Asian regional businesses.

“While the global electronics assembly marketplace currently faces challenging conditions on a number of fronts, Cookson’s commitment to its customer’s business success and to providing value-added products and services sets us apart from our competition,” said Ertmann, in a press release. “We are uniquely globally positioned to continue developing the advanced Alpha and CESP material technologies that enhance customer productivity, and to providing unparalleled applications expertise. These capabilities continue to be key to our success."

• Prev
• Next