SANTA ANA, CA – The Americas lags the world in HDI production, according to a new presentation delivered by Matt Holzmann last week.

Speaking at the IPC HDI Technology Conference in Dallas, Holzmann, president of Christopher Associates, said high density interconnect substrates production was $202 million in the Americas in 2006, far behind Southeast Asia ($3.6 billion), Japan ($1.5 billion), and Europe ($352 million). While the compound average growth rate of HDI in the Americas will be 7% through 2011, it will remain a distant fourth regionally, Holzmann said, citing data from Prismark Partners.

HDI is used in a wide range of end-products, ranging from cellphones to PC peripherals, medical gear and even aerospace. Cellphones make up nearly 40% of HDI board use, followed by IC package substrates at roughly 35%. Those two segments will remain the largest consumers by far through 2011.

Of the 3,600 laser drills installed worldwide, only 150 are in North America, Holzmann said. That reluctance to invest is one reason more than 80% of current demand filled from overseas sources, Holzmann said.

The presentation is available at www.christopherweb.com/pdf/MTHPresentation_HDI_10_2008.pdf.