Circuits Assembly Online Magazine - DoD Awards Endicott $12M R&D Contract

ENDICOTT, NY – Endicott Interconnect Technologies Inc. has been awarded a $12 million research and development contract by the U.S. Department of Defense to continue development of electronic packaging technologies, including PCBs and organic substrates for a super computer application.

This contract supports development of advanced high-speed electronic packaging technologies: specifically, system development, PCB and substrate design, along with the evaluation of alternative material sets.

Existing facilities have been expanded and modified to accommodate new equipment that has been purchased to support this work and EI anticipates additional hiring needs.