iNEMI is scheduled to discuss findings at industry venues worldwide, including Apex on Mar. 31 in Las Vegas; SMTA China East on Apr. 21 in Shanghai; at the Astride the Packaging Roadmap seminar, held at TWI Ltd. on Apr. 22 in Cambridge, UK, and at the European Microelectronics & Packaging Conference June 15-18 in Rimini, Italy.

The 2009 Roadmap covers five product sectors and 20 technology and business topics.  For additional information, visit http://www.inemi.org/cms/roadmapping/2009_Roadmap.html.

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