HAVERHILL, MA -- DKN Research and NY Industries have developed an embedded passive technology built on thin multilayer thick film flexible substrates.  The technology could be used to build printable flexible electronics, the firms said.

The technology involved a novel screen printing process package using thick film circuits as the basic technology. The process uses a specially formed printable ink on heat-resistant substrates (polyimide and PEN). It can be used for for single- and double-sided and multilayer circuits with various types of vias. The process provides a range between 10 and 100 megaohms for printed resistors with accuracy +/-10%, the firms claim. Printed capacitors are available for up to 5 nano farads in a 50 sq. mm space. Over 100 turns of printed inductors are available in a four-layer thick film flexible circuit.

Trials reportedly showed a broad range of capability in generating unique sensor modules on multilayer flexible substrates.

DKN is a US-based electronics material consulting firm. NY Industries is a Ohtsu, Japan-based PWB fabricator.

DKN provides engineering and consulting services to assist in the design and application process with the new advanced thick film flexible circuits, and provide free consulting to circuit designers and manufacturers that want to construct printable electronics.

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