MILWAUKIE, OR – A recent survey of engineers found that while more 90% were diligent in creating a correct profile, nearly 60% did not display that same diligence when it came to verifying that profile on a regular basis.
 
The survey, conduct by ECD following Apex, asked participants to answer specific questions about their practices regarding thermal processing. The results revealed the perceived difficulty and/or time required were the reasons behind verifying reflow profiles.  
 
Showing degradation of thermally sensitive passive components during reflow to be one of the main causes of product field failure, such degradation often is not picked up by traditional assembly test and inspection, says ECD. Instead, it often appears years later, when the product is in the user’s hands.
 
The firm says profiling remains key to preventing component degradation and product field failures.

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