LAS VEGAS – IPC is accepting abstracts for next year’s Apex technical conference.

Presentations are sought on all relevant design, PCB fabrication and manufacturing topics. Submissions in the areas of package-on-package assembly, printable electronics and advanced substrates are encouraged.
 
The program committee will choose abstracts that describe significant results from experiments, emphasize new techniques or discuss trends and test results. Awards will be presented to the best papers.
 
The deadline for abstracts and proposals is July 17.
 
The event will be held April 6 - 8 in Las Vegas. Professional development courses will take place April 8 - 9.
 
For more information, visit http://www.ipcapexexpo.org/html/2010/call-for-participation.htm.

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