WEST CONSHOHOCKEN, PA – Heraeus has acquired the microbond business division electronic packaging materials from Umicore AG & Co.
 
Heraeus has made an addition to its portfolio in the area of soft solder and flux material manufacture for use in the semiconductor industry.
 
Heraeus will gain 36 additional employees at its sites in Hanau, Germany and Singapore.
 
No financial terms were disclosed.

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