WATERLOO, ONTARIO – Terepac Corp. has begun shipping samples of its ultra-thin, flexible, silicon-based products from its plant here, says CEO Ric Asselstine.

Following four years of development, the company is entering into pilot scale production of Microscale Circuit Cluster products.

Terepac is beginning with HF/NFC and UHF embedded electronic products, and has signed agreements with two customers. It will progress into wirelessly networked sensors.

The company has signed a collaboration contract with a research institute to fabricate and commercialize a flexible medical monitoring system.

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