SHENZHEN -- SMTA China last week presented awards for seven papers for its annual SMTA South China technical conference.  

Among the winners:

• Flextronics’ Jesus Tan received The Best Paper of Technology Conference One for “Technical Evaluation for Pallet Material Selection.
• Shenzhen Kaifa Technology’s Zuyao Liu was awarded The Best Presentation of Technology Conference One for “Influence of PBGA Thermo Warpage on Soldering Joints’ Reliability.”
• iNEMI's Haley Fu was awarded The Best Paper of Technology Conference Two for  “iNEMI HFR-Free Program Introduction.”
• Martin Wen, from Indium’s Shenzhen rep office, received the award for The Best Presentation of Technology Conference Two for  “Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly.”
• Kyzen’s Phil Zhang was awarded The Best Paper of Vendor Conference One for “White Residue on Printed Wiring Boards Post Soldering/Cleaning.”
• Steve Glass of RMD Instruments was awarded The Best Paper of Vendor Conference Two for “Understanding XRF Technology and Clarification of its Application for Counterfeit Component Awareness and the RoHS Directive.”
• Nobe Yan of Ichumura - Shenzhen Kunqixinhua Technology was awarded Best Paper of Vendor Conference Three for “The Hazards of Tin Oxide Slag and Its Solutions.”

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