HERNDON, VA – The International Electronics Manufacturing Initiative is planning a two-day workshop to identify gaps and challenges related to organic substrate technology. The event will take place Nov. 17 and 18 in Nagoya, Japan.
 
The meeting will bring together OEMs, packaging firms and substrate providers to discuss technology requirements that must be addressed to facilitate continued miniaturization of electronics packaging.
 
The goal is to prevent organic substrate technology from becoming a limiting factor in the continued growth of electronics, iNEMI says.
 
Speakers will discuss packaging-related topics, such as next-generation product sector needs, assembly challenges, and emerging packaging formats. Working teams then will address key topics identified, and formulate potential industry action plans.
 
The agenda includes confirmed speakers from Amkor, ASE, Cisco, EIT, Ibiden, iNEMI, Intel, Kyocera, Nan Ya, Qualcomm, STATS ChipPAC, Texas Instruments and UMTC.
 
For more information, visit http://www.inemi.org/cms/calendar/Packaging_Substrates_Nov09.html. 

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