BANNOCKBURN, IL – A new industry white paper defines limits to guide use of several common SAC solders.

 
“Take Action Limits (TAL) for SAC305 Lead-Free Soldering Processes Utilizing Solder Baths/Pots” is based on testing of eight common SAC alloys that were subjected to strenuous tests, including wetting and electron microscope examination. The paper has been published by the IPC Solder Products Value Council, following a two-year study.
 
The white paper identifies three action levels: normal operation, increased monitoring and adjust pot. It sets TALs for 14 materials that commonly can be introduced during normal board production, such as gold, nickel and bismuth. In addition, scatter plot diagrams for all wetting test results and statistical analyses of wetting data are included.
 
IPC members can download the IPC TAL white paper free at www.ipc.org/SPVC-TAL-download.
 
Nonmembers may purchase the report at www.ipc.org/SPVC-TAL-purchase.

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