AUSTIN – A new research report on 3D through silicon via technology says volume production will prove difficult.

With volume production comes the difficult work of addressing issues of design, thermal management, test, and assembly, TechSearch International says. These issues include installation and qualification of high-volume 300 mm production lines, assembly and test capability, the availability of TSV interposers, and reliability data.

Drivers for the adoption of TSV technology include performance and form factor. However, different needs and economic factors determine the timing of adoption in each application, according to TechSearch, whose founder, Jan Vardaman, is a CIRCUITS ASSEMBLY columnist.

Future 3D TSV applications include DRAM, processors for computing and graphics, FPGAs, as well as processor and memory stacks for wireless products.

The firm highlights in a report the major processes and materials moving into production, including via fabrication methods, via filling, wafer thinning, and bonding methods.

The report provides an update on activities of companies and research organizations. Key barriers to 3D TSV adoption are reviewed with emphasis on design, thermal, and test and assembly issues.

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