KYOTO, JAPAN – Europe will play host next week to its first public Jisso European Council Seminar.

The event will provide the latest news from the JISSO meeting in Kyoto in May, as well as details about the new IEC standard development work for PCB with embedded components.

Jisso is a Japanese term for cooperation and refers to a loosely knit organization in Japan 12 years ago for electronics designers and packaging experts.

Aimed at electronics designers and process engineers, the session will offer details on chip design, packaging, PWB and PCB assembly and end-product, to aid understanding of design and manufacturing options.

Details are available at www.eipc.org.

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