PHOENIX -- FlipChip International has signed a patent license agreement and will buy polymer flux from Cookson Electronics, thus eliminating potential issues of patent infringement for component package manufacturers using the FCI’s Polymer Collar process.

No financial terms were disclosed.

"We have found that most of the leading package suppliers to the handheld market have a strong interest in Polymer Collar technology, but have been reluctant to implement the technology due to their concern over possible patent infringement," said Chris Bastecki, vice president and general manager at Cookson Electronics Semiconductor Products. "This license agreement really opens the path and facilitates the full industry utilization of this enabling technology."

The process is said to expand the use of wafer-level packages to larger die sizes and and increase their functionality.

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