SANTA CLARA, CA – MEPTEC will host a semiconductor packaging symposium on Nov. 10 here.

Speakers will take a look at trends and projections in packaging technology with an event covering technical roadmaps from throughout the industry, including IDMs and OEMs, as well as packaging houses and EMS providers. 

Mark Brillhart of Cisco will keynote with Technology Innovation in High Performance Networking Products. He will explore innovations in high-performance packaging that meet the challenges of high-speed electrical performance, signal and power integrity and enhanced thermal dissipation, and address the strenuous requirements of product-level reliability, high availability and long field life.

Technical sessions include Semiconductor Industry Roadmaps: Carving out the Decade Ahead; SATS Technology Development:  Merging Internal and Customer Roadmaps; System-Level Implications on IC Package Design, and Packaging Roadmaps for Emerging Applications.

For more information, visit http://www.meptec.org/meptecroadmaps20.html. 

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