US Patent Issued for Wemtec’s Noise Suppression Method in PCBs
ALEXANDRIA, VA – The US Patent and Trademark office has granted Wemtec a patent for a “circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards.”
William E. McKinzie III and Shawn D. Rogers of Maryland developed the apparatus that suppresses noise and electromagnetic coupling in the printed circuit board of an electronic device. It “includes an upper conductive plate and an array of conductive coplanar patches positioned a distance t.sub.2 from the upper conductive plate. The distance t.sub.2 is chosen to optimize capacitance between the conductive coplanar patches and the upper conductive plate for suppression of noise or electromagnetic coupling.
The apparatus further includes a lower conductive plate a distance t.sub.1 from the array of conductive coplanar patches and conductive rods extending from respective patches to the lower conductive plate.”
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