BUCKS, UK – SMART Group has announced upcoming technical webinars on micro-BGA assembly and developing an electronics inspection system.

In the first, micro-BGA reevaluates an existing manufacturing process, inspection and size control of different solder alloy spheres. It will provide example packages and demonstrate reliability through assembly and soldering trials within different industries. Topics include project overview, industry survey, micro-BGA requirements, solder alloy requirements, solder sphere manufacture, existing process and issues, and future industry benefits.

The second webinar concerns the development of an electronics system for inspecting welded joints in plastic pipes. It will cover the current objectives of the TestPEP project; an overview of the work program; the principles of phased array inspection, butt fusion welds, and electrofusion welds; and initial results.

To register for both, visit www.smartgroup.org/diary.

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