WRIGHT-PATTERSON AFB, OHIO -- The US Air Force research division will provide a grant worth up to $1.6 million for new work that eliminates risks of tin whiskers and related problems.

The Air Force Research Laboratory (AFRL) last week issued a call for technical and cost proposals as part of its latest attempt to tackle the problem. The proposal is offered under the AFRL's Mitigating Reduction of Hazardous Substances (RoHS) Lead-Free Issues in Aerospace Circuit Board Manufacture program.

The AFRL is particularly concerned with the possibility that lead-free solder alloys might be used in high-reliability aerospace electronics, and is looking for ways to mitigate potential failure mechanisms. Tin and tin-plated alloys are known to migrate, or form whiskers, that in certain environments can cause shorts and product failure. Lead has been proven to curtail tin whiskering.

The AFRL said the scope of the project would include fusing matte tin on lead-free parts and printed circuit boards.

The program will be worth a minimum of $800,000, and up to $1.6 million,and could be awarded by June 30, and would be expected to be completed within 15 months.

Interested parties may contact Crystal Price (crystal.price@wpafb.af.mil) or click here for more information.

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