OXFORDSHIRE, ENGLAND – Smart Group has issued a call for papers for its Area Array Assembly & Reliability Conference – Table Top Exhibition. The event takes place here Oct. 5 and 6.

The event will focus on area array design, assembly, reliability, cleaning and conformal coating.

Suggested topics include industry trends on area array packaging; design and reliability of BGA and uBGA devices; advanced printed board design and fabrication techniques; component developments and future packaging; soldering and joint reliability of Pb-free and mixed alloys; overcoming pad cratering on laminates; coating and its impact of joint reliability, and tin whiskers and benefits from coating assemblies.

Email papers to technical@smartgroup.org. Include a title, abstract, speaker’s name and company.

The deadline for submitting abstracts is May.

For more information, email info@smartgroup.org.

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