TEDDINGTON, UK – NPL’s electronic interconnection group will present eight free one-hour technical webinars over the coming months.

The webinars focus on test methods used to monitor or help evaluate possible failure modes in electronic assemblies. 

The webinar schedule is as follows: Tin Whiskers Evaluation Techniques & Benefits of Conformal Coating, June 22; X-Ray Fluorescence Testing Results with Laboratory & Handheld Systems, Sept. 8; Solderability Assessment – Testing, Aging & Practical Impact on Assembly Yield, Oct. 11; How to Test & Qualify Packages with Scanning Acoustic Microscopy (SAM), Oct. 27; Using Surface Insulation Resistance (SIR) to Qualify Production Processes & Materials, Nov. 8; Cleanliness Assessment Using Solvent Extract & Ionic Extraction to Improve Reliability, Nov. 24; Characterization of Solder Joints, Test Methods & Typical Failure Modes, Jan. 24; Using Mechanical Testing to Diagnose Design, Product & Process Failures, Feb. 21. 

To register, visit http://www.npl.co.uk/ei.   

The group will also host a European technical seminar at its facility in Teddington, UK, on Oct. 29.

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