NEVADA CITY, CA – A new report offers an in-depth look at the worldwide integrated circuit packaging market.

The Worldwide IC Packaging Market, 2011 Edition, provides individual IC device market forecasts for units, revenue and ASP, from 2008 through 2014. It was authored by New Venture Research.

The package solutions for each of these markets are forecast, broken down into I/O ranges. Package types are rolled up to deliver an overall worldwide forecast of IC packages, divided into 12 different package families, plus bare die solutions. 

Major package families include dual in-line package; small outline transistor; small outline; thin small outline package; dual flat pack no lead; chip carrier; quad flat pack; quad flat pack no lead; pin grid array; ball grid array; fine-pitched ball grid array, and wafer-level package.

Also, unit forecasts for die mounted using direct chip attach methods were developed. DCA methods include chip on board, flip chip on board, chip on glass, flip chip on glass, and tape automated bonding/tape carrier package.

The contract IC packaging market is forecast, and units and revenue are analyzed by package family. Profiles of individual contract IC package assemblers are also provided. 

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