FARGO, ND -- North Dakota State University researchers have developed a noncontact wafer-to-product electronics manufacturing technology said to reduce unit cost and size of electronics end-products.

Using laser-enabled advanced packaging (LEAP) techniques, NDSU's Center for Nanoscale Science and Engineering reportedly assembled semiconductor chips of less than 50 µm onto flexible and rigid substrates. The method is said to be lower cost and faster than conventional means of package assembly.

The patent-pending Thermo-Mechanical Selective Laser Assisted Die Transfer process is a part of the LEAP technology first developed in 2008. According to the school, SLADT can place the chips at specific orientations and selective locations on a flexible substrate.

Among the components that can be attached are fine pitch, ultra-thin, passives and actives, the school says. The process can also be used in other assembly and microelectromechanical system (MEMS) fabrication applications, the school says.

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