TORRANCE, CA – Seika Machinery said an independent lab has confirmed its Solder Paste Recycling machine is capable of producing pure solder ingots from solder paste.

The ingots produced by the SPR Unit are reportedly 100% pure, with no additives or impurities added to the solder paste during the recycling process. The system removes the flux from the metal and produces a flux-free ingot. There are no voids inside the solder ingots, says Seika.

A number of analyses were performed, including Fourier Transform Infrared Spectroscopy, Inductively Coupled Plasma technique, and Scanning Electron Microscopy.

The machine enables 100% of the metal content of waste solder paste to be recovered as solder bar, the firm says.

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