BANNOCKBURN, IL – The printed circuit board industry's standard document for terms and definitions used on everything from master drawings to procurement contracts has been updated.

IPC on Tuesday announced the released IPC-T-50J, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. The J revision contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing, moisture sensitive components, and microvia technology.

The committee receives input from International Electrotechnical Commission, Japan Electronics Packaging and Circuits Association, and European Institute of Printed Circuits.

For more information, visit www.ipc.org/T-50j.

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