TORONTO – The SMTA Toronto chapter requests abstracts for the International Conference on Soldering and Reliability (ICSR), May 15-18.

Suggested topics include Pb-free assembly and test; manufacturing process; reliability; package on package; harsh environment; corrosion; tin whiskers; halogen-free laminates; new alloys; high-density interconnects; electromigration; thermal interface materials; thermal dissipation; underfill; environmental compliance/regulations; printed electronics; conformal coating, and die attach soldering and L-F challenges. 

Submit 200- to 300-word abstracts to Patti Hvidhyld at patti@smta.org. Abstracts are due Jan. 13.

Authors will be notified of acceptance by February. Technical papers are required on Mar. 30.

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