BANNOCKBURN, IL — IPC last month released its latest technoloy roadmap, the biennial guide to interconnect technological trends.

The 2011 roadmap incorporates data and comparisons to help users serve clients and/or guide their companies in identifying, selecting and developing the right technology alternatives to create the products needed for future markets.

The roadmap includes expanded regional analysis and comparison. In both the substrate and assembly sections, it provides insight into the regional differences in capability between Asia, Europe and North America.

Another addition is the link of emulators to industry standards and specifications. A new section discusses the changes that need to occur in industry standards content to make them relevant to tomorrow’s needs. This includes the addition of a state-of-the-art level for product features that demand a higher degree of precision.

In areas where changes occur quickly, such as the environment, health and safety, regulations and global stewardship, the roadmap has been updated to reflect the current state and future issues.

For more information, visit www.ipc.org/roadmap.

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