HIGH WYCOMBE, BUCKS, UK – The Smart Group will present a 60-minute webinar on using solder spheres in fine-pitch area array rework on Aug. 20.

Technical committee member Bob Willis will examine the use of solder spheres during rework of BGA, CSP and other area array packages, as well as quality control of solder spheres for the assembly process and what areas should be specified.

This webinar will focus on reballing of area-array packages; methods of adding solder balls; use of solder spheres and benefits; solder alloy; sphere size; inspection and quality control, and reliability of reballed packages.

For more information, visit http://www.smartgroup.org/events-diary/.

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