SMYRNA, GA – CIRCUITS ASSEMBLY today announced the opening of its 2014 New Product Introduction Awards (NPI) for printed circuit board assembly.

The NPI Awards recognize the leading new products for PCB assembly introduced in the 2014 calendar year. Awards are selected by an independent panel of judges from the industry and presented by CIRCUITS ASSEMBLY.

Awards will be presented in the following categories: Equipment: automation tools (conveyors, feeders, etc.); bonders; cleaning equipment; component placement - high-speed; component placement - multi-function; component storage; device programming; dispensing equipment; labeling equipment; process control tools; rework and repair tools; screen/stencil printing; screen/stencil printing peripherals/consumables; soldering - reflow (convection); soldering – wave; soldering – selective; soldering – other (vapor phase, hot bar, laser, etc.); soldering – hand tools; software - process control; software – production; software – management (ERP, MRP, etc.); test and inspection – AOI; test and inspection – AXI; test and inspection – ICT; test and inspection – SPI; test and inspection – functional test; first article inspection; Materials: adhesives; cleaning materials; coatings/encapsulants; underfills; flux; soldering materials (paste, bar, wire, core, etc.); cored wire.

The deadline for entries is Jan. 20, 2014. To be eligible, entries must have been introduced to market (any region) no earlier than Mar. 1, 2013.
 
Entries will be judged on creativity and innovation, compatibility with existing technology, cost-effectiveness, reliability, performance and user-friendliness.
 
Awards will be presented during a ceremony on Mar. 25, 2014, during the IPC Apex Expo in Las Vegas.
 
For more information, visit http://www.circuitsassembly.com/cms/npi-award, or contact senior editor Chelsey Drysdale at cdrysdale@upmediagroup.com.

To register, visit https://www.regonline.com/register/login.aspx?eventID=1229884&MethodId=0&EventsessionId.

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