FT. WORTH, TX -- The effects of the US government shutdown failed to corral the atmosphere at SMTA International this week, where attendees appeared more active and buoyant this year than last.

Aided in part by the addition of the IPC technical committee meetings, which added scores of engineers and others to the annual weeklong event, traffic at the two-day exhibition appeared busier this year, albeit still susceptible to the occasional quiet period.

The technical sessions were consistently active and engaging, however, with many attendees reiterating past statements that SMTAI remains a superb, if not the best, technical conference for electronics assembly today.

Keynoter Bob DuLaney, a retired US Air Force Major General now at Lockheed Martin, gave a strong and occasionally passionate speech on behalf of the F-35 warfighter. DuLaney pointed out that the current generation of airfighters is 35 years old, while the next generation comes equipped with interoperable sensors, electronic attack systems, and some 8.6 million lines of code -- or roughly four times that of the F-22.

Well over 100 papers were presented during the week. DfR Solutions' Cheryl Tulkoff provided a scintillating explanation of how to improve process audits of suppliers. She emphasized the value of procurement teams having direct experience with the products they buy. Given the US's dependence on board brokers, she noted how with distributors often comes confusion over responsibilities. She also pointed out that IPC is headed toward developing a Qualified Manufacturers List (QML).

In a solder alloy session, a trend away from high Ag solders was discussed, with criticisms centering on the cost, especially for consumer goods, and reliability issues. The drawbacks of various dopants was also a point of concern, given their reaction with many fluxes and the resultant tendency to inhibit wetting and cause other soldering problems.

During a session on BTCs, Steve Kummerl, an engineer at TI, revealed a video showing how solder paste moves that left some watchers in awe. Best part: Kummerl wasn't even an presenter; he was an attendee.

Much of the business talk revolved around what is, or is not, happening to DEK. The screen printer OEM has been on the block for a year, and rumors were flying that ITW had come close to a purchase, only to walk away. ASM (the former Siemens) is now considered the frontrunner; an announcement is expected in November.

Conversations with suppliers generally revolved around business (improving for some, middling for most), and the emergence of metric 0201 parts. Placement OEMs such as Fuji, ASM and Juki felt placing such miniature packages would not be a problem, requiring fairly minor adjustments to nozzles. The carrier tape might actually be the bigger issue, noted Martin Hart of TopLine Components. Tests thus far have been performed using 4mm embossed tape, generally with parts from Rohm. However, there is much puzzlement over how such parts, which are about 60% the body size of an 01005, will be printed. Some suggest using a 2 mil stencil for the metric 0201s, then a 5 mil stencil for larger parts, a solution that would require additional cost (perhaps even another printer) and process steps. Others felt a jetting or sputtering process might be more suitable. Decisions better be made soon: Fuji said production could begin as soon as the first quarter 2014.

Transition Automation showed a Permalex stencil that lifts and then moves in the opposite direction, thus resolving, says inventor Mark Curtin, problems with solder paste sticking often experienced by dual squeegee systems.

Inspection OEMs said engineers are asking more about 3D. Don Naugler at VJ Electronix added that he sees a trend toward systems that can view bigger sockets (such as ones for IBM's largest BGAs) and boards.

SMTAI moves to Chicago next year, a migration welcomed by most with whom CIRCUITS ASSEMBLY spoke.

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