ROSEMONT, IL – SMTA seeks papers for its annual SMTA International conference here next year.

Abstracts for the Sept. 28-Oct. 2 event are due Feb. 28.

Papers are sought on the following topics: advanced packaging/components; assembly; business/supply chain; emerging technologies; harsh environment applications; PCB technology, and process control. Speakers receive a discount on conference registration.

Best of Conference, Best of Proceedings, and Best International papers receive $1,000 cash awards.

New this year, a $500 award will be given to the Best Student Paper.

Proposals are also solicited from individuals interested in teaching educational courses related to surface mount technology, advanced packaging, and electronics manufacturing. Course length is one half-day, and proposals are due Feb. 28.

Technical papers and course outlines are due July 14. Papers should be 6-15 pages long (including graphics) and describe significant results from experiments, emphasize new techniques, or contain technical, economic, or appropriate test data.

Presentation materials and papers must be original, unpublished, and non-commercial in nature.

Visit www.smta.org/smtai/call_for_papers.cfm for complete details.

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