TORONTO – The 2014 International Conference on Soldering and Reliability will be held May 13-15 here, says SMTA.

Martin Anselm, Ph.D., Manager AREA Consortium, Universal Instruments, will deliver the keynote: A View of the Electronics Industry Process, Reliability, and Materials Research Landscape.

Half-day workshops include Implementing High Reliability Lead-Free Assembly and Test Methodology; Tolerance Forgotten: Impacts of Today's Component Packaging and Copper Routing on Electronic Assembly; Electrochemical Migration and Conductive Anodic Filament (CAF) Formation; Design for Manufacturing (DFM): When a Six Sigma Process Is Not Sufficient To Achieve A High Yielding Manufacturing Process

The technical conference features 26 presentations on topics ranging from new solder alloy tests to stencil printing and tin whisker mitigation. Speakers include Alpha, BAE International, Blackberry, Celestica, Indium, Rockwell Collins, Senju Comtek, Universal Instruments, Akita University, National University of Singapore, University of Toronto, and SUNY Binghamton.

The event will be co-located with the SMTA Toronto Expo.

Contact Emmy Ross at  952-920-7682 or emmy@smta.org for more information. To register, visit http://www.smta.org/icsr.

The Early Bird registration deadline is Apr. 11.

Contact Patti Coles at  952-920-7682 or patti@smta.org with questions.

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