ANSEONG, SOUTH KOREA -- A massive fire has laid waste to a printed circuit board factory here that was building multilayer boards for Samsung's next-generation smartphone. The fire also caused millions of dollars in damage to equipment and took hundreds of firefighters some six hours to contain, according to media reports.

The plant, which is owned by DAP Co., was building boards for the Galaxy S5 phone. DAP is a major supplier of HDI boards to Samsung, according to Dr. Hayao Nakahara of NT Information.

The fire broke out Sunday morning local time.

Samsung issued a statement that it has other PCB suppliers and the damage won't delay the phone's April 11 launch.

Fires are becoming somewhat commonplace at major PCB factories in Asia. Gold Circuit and Viasystems are among those that suffered significant damage from blazes in the past few years.

Ed: Due to a reporting error, an earlier version of this story indicated the site belonged to Samsung Electro-Mechanic (SEMCO). That report was incorrect, and CIRCUITS ASSEMBLY regrets the error.

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