LAS VEGAS – CIRCUITS ASSEMBLY today announced the winners of the 2014 New Product Introduction Awards for electronics assembly equipment, materials, software, and PCB fabrication. The 7th annual NPI Awards recognizes leading new products during the past 12 months.

An independent panel of practicing industry engineers selected the recipients.

The winners are:

• Soldering Materials: Henkel Electronic Materials (90iSC Alloy and Loctite Multicore HF212 Flux Medium)
• Cored Wire: Nihon Superior (SN100C (031) Pb-free Flux-Cored Solder Wire)
• Adhesives: Henkel Electronic Materials (Loctite TAF-8800 Thermal Absorbent Film)
• Screen/Stencil Printing Equipment: Juki Automation Systems and GKG Asia
• (GL Fully Automatic Solder Paste Printer)
• Screen/Stencil Printing Peripherals: Aculon (NanoClear)
• Dispensing Equipment: Nordson Asymtek (Spectrum II S2-900 Series)
• Component Placement – Multifunction: Essemtec (Paraquda)
• Component Placement – High-Speed: Juki Automation Systems (RX-7 High-Speed Compact Modular Mounter)
• Soldering - Reflow: ERSA (Hotflow 4/26)
• Soldering – Selective: Juki Automation Systems and Inertec (Cube)
• Soldering – Other: EVS International (EVS 500)
• Software – Process Control: Cogiscan (Factory Intelligence Monitoring Module)
• Software – Production: Panasonic Factory Solutions (PanaCIM)
• Test & Inspection – SPI: Parmi (Sigma X)
• Test & Inspection – AOI: MIRTEC (MV-7 Omni 2D/3D In-Line AOI)
• Test & Inspection – AXI: ViTrox (V810 XXL In-Line 3D AXI)
• Test & Inspection – ICT: Seika Machinery (FA1240-51 Flying Probe Tester)
• Test & Inspection – Functional Test: Nordson Dage (Camera Assist Automatic Bondtesting)
• Rework & Repair Tools: Metcal (Metcal HCT2-120 Digital Hot Air Pencil)
• Cleaning Materials : Kyzen (Aquanox A8830 Low VOC Aqueous Stencil Cleaning Agent)
• Bonders: Palomar Technologies (8000i Wire Bonder with i2Gi)
• Automation Tools: Count On Tools (StripFeeder Modular (.mod) System v. 2)
• Device Programming: Data I/O (PSV7000)

The awards were presented during a ceremony at IPC Apex Expo in Las Vegas.

“What stood out in 2013 was the improvements to functionality on many machines,” said Mike Buetow, editor-in-chief of PCD&F and CIRCUITS ASSEMBLY. “Software enhancements were especially prevalent among the winning entries.”

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