BANNOCKBURN, IL —  A new white paper from The IPC Solder Products Value Council and iNEMI provides insights for determining which lead-free solder alloys characteristics best match product requirements. 

After extensive consideration of what physical parameters were most important for reliability, IPC SPVC experts determined that solder creep was one of the key factors that determined many solder qualities.

"If alloys have similar creep values, they are expected to have similar reliability performance over a product's lifetime," said Greg Munie, IPC director of design programs. In addition, the white paper establishes test protocols for new solder alloys that provide “portable data,” that is, data that are reproducible and not dependent on test location. The protocols formalize testing requirements, reduce the cost of testing, and help the industry better understand the basic physics and metallurgy of lead-free alloys in manufacturing and end-use applications.

"This will have some appeal for anyone involved in manufacturing," Munie said. "It is our hope that companies can compare physical properties and make informed decisions. They won't have to build models and thermally cycle for every alloy."

The paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, is available as a free download from IPC.

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