WALTHAM, MA -- Test Research Inc. next month will host a technology seminar here to introduce recent technological advances in PCBA testing and inspection.

 The Sept. 19 seminar will focus on new developments in 3D solder paste inspection (SPI) and 3D automated optical inspection (AOI), and concludes with a session on TRI’s 3D AXI and in-circuit testers. On-site product demonstrations will also be given.

To register contact Fendi Lin at f or call +408-567-9898. The agenda and online registration are available here.

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