BANNOCKBURN, IL – IPC has released the F revisions of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies.

The documents have been updated to include technical advances in solder on plastic surface mount components, new criteria for P-style and solder-charged Butt/I SMT terminations, a change to void criteria for BGAs, and enhancements to the language within the documents to provide ease of use and clarity.

IPC committee members focused changes in areas such as the shrinking sizes of plastic packages that affect solder touching component bodies.

The chapter on conformal coatings also underwent significant changes.

The standards also cover Class 2 plated through-hole vertical solder fill
requirements and Class 2 flux activity criteria.

For more information, visit www.ipc.org/001.  

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