MCPs Gaining in Use, New Study Finds
NEVADA CITY, CA -- Multichip packages are grabbing a larger share of the overall IC packaging market, and will climb to 34% of the total parts in use by 2019, based on revenue.
Overall sales of MCPs will reach $44 billion by 2019, up from $14.4 billion this year. Market share by revenue will climb four percentage points during that time, says New Ventures Research, which recently published a study on MCPs.
MCPs include a broad range of vertically stacked packages including TSOP, FBGA, QFN and WLP, as well as cimplex system-in-package devices, multichip modules (MCM), package-in-package(PiP) and package-on-package (PoP).
Fan-out wafer-level packages will increase the number of leads traditional WLPs are capable of, and are now in vilume production, with more than 10% of all WLPs including the fan-out technology, NVR said.
Press Releases
- Altus Partners with Sellectronics to Enhance Manufacturing Capabilities with PVA Delta 8 System
- ITW EAE Celebrates Major Milestone in Domestic Manufacturing Expansion
- Micro Technology Services Selects PBT Works CompaCLEAN III for Advanced PCB Cleaning Performance
- Indium Corp. is Electrifying the Future with Advanced Materials Solutions at Productronica