MINNEAPOLIS, MN – The SMTA seeks abstracts for its annual conference on design, material, and process technologies for wafer-level packaging applications.

Abstracts of 200- to 300-words are sought for the 12th Annual International Wafer-Level Packaging Conference, taking place Oct. 13-15 in San Jose. This year's event will emphasize device and end product applications ‑ RF/wireless, sensors, mixed technology, optoelectronics ‑ that demand wafer level packaging solutions.

The conference includes three tracks with two days of technical paper presentations covering wafer level packaging, 3D (stacked) packaging, and MEMS packaging.

When submitting an abstract, include a title, author name, and contact information. Abstracts are due Apr. 17. Technical papers are due Aug. 21.

For more information, contact Patti Coles at patti@smta.org or visit http://www.iwlpc.com/.
 

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