SCHAUMBURG, IL – A free assembly, cleaning, coating, and reliability workshop will take place here June 23. Topics include printed circuit board failure mechanisms, solder paste challenges, surface analytics, conformal coating, and low-cost solutions.

Among the speakers are:

• Bruce Barton, assembly process specialist, Alpha, who will present When to Consider Type 4 Solder Paste.
• Kon Akbar, technical director, Stentech, who will present Stencil Design and Stencil Material Guidelines.
• Kalyan Nukala, M.S.Ch.E., application engineer at Zestron Americas, who will discuss Improvements in Yield and Reliability for SMT Processes via Cleaning.
• Jacek Knop, sales manager for the Americas, HumiSeal, who will share Integrated Conformal Coating Solutions for Better PCBA Reliability.

Zestron, Alpha, Stentech and HumiSeal are hosting the event. For more information, visit http://www.zestron.com/us/academy.html. 

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