AUSTIN, TX -- A new research report helps dissect new component package options for split die.

TechSearch International’s latest Advanced Packaging Update focuses on making sense out of the alphabet soup of package types, targeting high-performance solutions for devices such as FPGAs to application processors found in mobile devices.

SLIM, SWIFT, EMIB, NTI, and SLIT are high-density substrates without through silicon vias (TSVs). Fan-out wafer level packages (FO-WLPs) are another option for a split die package. Roadmaps from FO-WLP suppliers show the transition to finer features.

Package options for power devices are also discussed, including a special section on automotive packages. A detailed analysis focuses on the trends in copper (Cu) clip packages for MOSFETs. A double-digit growth rate is projected for this increasingly popular package. Also included is an update on the market for embedded component packages with a new market forecast split into actives and passives.

The detailed analysis is based on the company’s 27-year history of studying markets and critical technology and infrastructure issues in advanced packaging. The 37-page report with full references provides analysis on these important developments. A set of 30 PowerPoint slides accompanies the report.

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