SURREY, UK -- Printing solder paste or other conductive material requires zero defects printing if a high first-pass-yield is to be achieved when using fine-pitch components. Monitoring and control of paste height and volume are becoming the norm in many markets, but what capability can be expected?

Correct printer setup, good stencil design and manufacture plus consistent printing materials are key to successful manufacture, but inspection and monitoring the performance makes a process more robust. The same three dimensional inspections is required in other AOI applications like solder joint analysis. An upcoming webinar will tackle causes and cures of common process defects during printing and reflow to help yield improvement.
 
The webinar, to be presented by Bob Willis, SMTA process feature organizer,  will cover such topics as:

·         Solder paste inspection standards
·         Soldering yield impact with poor printing
·         Common solder paste defects
·         Impact on reliability based on paste thickness
·         Solder joint inspection defects
·         Common process defects causes and cures
 
Register your place https://attendee.gotowebinar.com/register/853010282022478338. 

A copy of the slides will be sent following the webinar.
 
The event is part of the pre-show technical events associated with SMTA/NPL Solder Paste and Solder Joint Automatic Inspection Experience, which takes place at SMTAI in later September and includes live demonstrations on how to get optimize SPI and AOI systems. Visit http://www.smta.org/smtai/sMTAIExperience.cfm  for details.
 
·         The event is supported by CIRCUITS ASSEMBLY.

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