DUSSELDORF, GERMANY – Henkel Adhesive Technologies and molding equipment manufacturer LPMS USA have formed a partnership for building molded assemblies.

Under the agreement, LPMS will process Henkel’s Technomelt polyamide hotmelt materials around electronic devices, encapsulating them and forming self-enclosed, functional assemblies. LPMS’s “melt on demand” feature reportedly melts the material only when required.

“Henkel’s new relationship with LPMS USA is a very important development for our Americas-based customers,” said Art Ackerman, Henkel global product manager for Circuit Board Protection. “The company’s global leadership, in-depth understanding of mold design, broad equipment portfolio and low pressure molding expertise make LPMS USA a very competent partner.”

No financial or other terms were disclosed.

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